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    Manufacturing

     SOIC Series

    Packaging NamePin QuantityPackaging Size
    (Length*Width)/mm
    Packaging
    Thickness(mm)
    Pin Distance/mmRemarks
    SOIC/8LD84.902x3.9371.4491.27 
    SOIC/8LD-384.902x3.9371.4491.27lack PIN3
    SOIC/8LD-784.902x3.9371.4491.27lack PIN7
    SOIC-EP/8LD84.902x3.9371.4491.27EDP 3.086x2.20
    FCSOIC/8LD84.902x3.9371.4491.27Flip chip
    SOIC(M)/14LD148.698x3.9571.4491.27 
    SOIC(M)/14LD-10~12148.698x3.9571.4491.27lack PIN10-12
    SOIC(M)/14LD-6148.698x3.9571.4491.27lack PIN6
    SOIC(M)/N16LD169.88x3.931.4491.27 
    SOIC(M)/W16LD1610.338x7.5182.3181.27 
    SOIC(M)/20LD2012.789x7.5182.3181.27 
    SOIC(M)/24LD2415.44x7.5182.3181.27 
    SOIC(M)/N28LD2817.907x7.4932.3061.27 
    SOIC(M)/N28LD-12817.907x7.4932.3061.27lack PIN10-12


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